High-Speed Digital PCB Design

At Zaenex, we deliver RF and High-Speed Digital PCB Designs that set new standards for performance, signal integrity, and reliability in complex multi-channel systems.

  • Impedance Control: Precise layer stack-up design to maintain target impedance (typically 50Ω) within ±5% tolerance.
  • Crosstalk Mitigation: Optimized routing and spacing strategies ensuring FEXT below 3%.
  • Differential Pair Routing: Tight trace length matching (≤ 5 mils) and phase skew control (≤ 10 ps) for noise immunity.
  • Power Integrity (PI): Strategic decoupling and low-inductance power planes for stable delivery.
High Speed PCB Design
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